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INTEGRATED CIRCUITS
DATA SHEET
TDA7052 1 W BTL mono audio amplifier
Product specification File under Integrated Circuits, IC01 July 1994
Philips Semiconductors
Product specification
1 W BTL mono audio amplifier
GENERAL DESCRIPTION
TDA7052
The TDA7052 is a mono output amplifier in a 8-lead dual-in-line (DIL) plastic package. The device is designed for battery-fed portable audio applications. Features: * No external components * No switch-on or switch-off clicks * Good overall stability * Low power consumption * No external heatsink required * Short-circuit proof QUICK REFERENCE DATA SYMBOL VP Itot Gv Po THD PARAMETER Supply voltage range Total quiescent current Voltage gain Output power Total harmonic distortion THD = 10%; 8 Po = 0,1 W RL = CONDITIONS 3 - 38 - - MIN. 6 4 39 1,2 0,2 TYP. 8 40 - 1,0 MAX. 18 V mA dB W % UNIT
PACKAGE OUTLINE 8-lead DIL; plastic (SOT97); SOT97-1; 1996 August 21.
July 1994
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Philips Semiconductors
Product specification
1 W BTL mono audio amplifier
TDA7052
Fig.1 Block diagram.
PINNING 1 2 3 4 VP IN GND1 n.c. supply voltage input ground (signal) not connected 5 6 7 8 OUT1 GND2 n.c. OUT2 output1 ground (substrate) not connected output2
July 1994
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Philips Semiconductors
Product specification
1 W BTL mono audio amplifier
FUNCTIONAL DESCRIPTION
TDA7052
The TDA7052 is a mono output amplifier designed for battery-fed portable audio applications, such as tape recorders and radios. The gain is fixed internally at 40 dB. A large number of tape recorders and radios are still designed for mono sound, plus a space-saving trend by reduction of the number of battery cells. This means a decrease in supply voltage which results in an reduction of output power. To compensate for this reduction, the TDA7052 uses the Bridge-Tied-Load principle (BTL) which can deliver an output power of 1,2 W (THD = 10%) into an 8 load with a power supply of 6 V. The load can be short-circuited at each signal excursion. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL VP IOSM Ptot Tc Tstg Supply voltage Non-repetitive peak output current Total power dissipation Crystal temperature Storage temperature range - -55 PARAMETER - - MIN. MAX. 18 1,5 see Fig. 2 150 +150 C C V A UNIT
Fig.2 Power derating curve.
POWER DISSIPATION Assume VP = 6 V; RL = 8 ; Tamb = 50 C maximum. The maximum sinewave dissipation is 0,9 W. 150 - 50 R th j-a = --------------------- 110 K/W. 0, 9 Where Rth j-a of the package is 110 K/W, so no external heatsink is required.
July 1994
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Philips Semiconductors
Product specification
1 W BTL mono audio amplifier
CHARACTERISTICS VP = 6 V; RL = 8 ; f = 1 kHz; Tamb = 25 C; unless otherwise specified. SYMBOL Supply VP Itot Gv Po Supply voltage range Total quiscent current Voltage gain Output power Noise output voltage (RMS value) Vno(rms) Vno(rms) fr SVRR V5-8 THD ZI Ibias Frequency response Supply voltage ripple rejection DC output offset voltage pin 5 to 8 Total harmonic distortion Input impedance Input bias current RS = 5 k PO = 0,1 W - - - - - 0,2 100 100 note 3 note 1 note 2 - - - 40 150 60 20 Hz to 20 kHz 50 - THD = 10% RL = 3 - 38 - 6 4 39 1,2 18 8 40 - PARAMETER CONDITIONS MIN. TYP.
TDA7052
MAX.
UNIT
V mA dB W
300 - -
V V Hz dB mV % k nA
100 1,0 - 300
Notes to the characteristics 1. The unweighted RMS noise output voltage is measured at a bandwidth of 60 Hz to 15 kHz with a source impedance (RS) of 5 k. 2. The RMS noise output voltage is measured at a bandwidth of 5 kHz with a source impedance of 0 and a frequency of 500 kHz. With a practical load (R = 8 ; L = 200 H) the noise output current is only 100 nA. 3. Ripple rejection is measured at the output with a source impedance of 0 and a frequency between 100 Hz and 10 kHz. The ripple voltage = 200 mV (RMS value) is applied to the positive supply rail.
July 1994
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Philips Semiconductors
Product specification
1 W BTL mono audio amplifier
TDA7052
Fig.3 Application diagram.
July 1994
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Philips Semiconductors
Product specification
1 W BTL mono audio amplifier
PACKAGE OUTLINE DIP8: plastic dual in-line package; 8 leads (300 mil)
TDA7052
SOT97-1
D seating plane
ME
A2
A
L
A1
c Z e b1 wM (e 1) b2 5 MH
b 8
pin 1 index E
1
4
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001AN EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-04
July 1994
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Philips Semiconductors
Product specification
1 W BTL mono audio amplifier
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA7052
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
July 1994
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